Sputtering Target
Sputtering is a deposition process in which atoms are released from a solid source material and deposited onto a substrate to form a thin film. It is widely used in the semiconductor and electronics industries for precision coating applications.
Sputtering targets are commonly manufactured from high-purity metals, alloys, and ceramics, with demand driven by applications in the semiconductor, display, and protective coating industries.
Our Target department specialises in providing a comprehensive range of high-quality high-performance planar sputtering targets, available in all materials and typically in the shape of discs or rectangular plates.
Aluminium (AI)
Chromium
Copper (CU)
Gadolinium
Germanium
Iridium
Iron
Magnesium
Manganese
Molybdenum (Mo)
Nickel
Ruthenium
Selenium
Silicon (Si)
Strontium
Tantalum (Ta)
Tellurium
Titanium (Ti)
Tungsten (W)
Vanadium
Zinc
Alloy Sputtering Targets include most commonly:
Aluminium alloy
Iron alloy
Cobalt alloy
Nickel alloy
Titanium alloy
Zirconium alloy
These lists are not exhaustive and target can be supplied in a wide range of materials.
Fabricated Items
Physical forms would include wire, tube, plate, sheet, rod and foil in metals and alloys based on titanium, zirconium niobium, molybdenum, hafnium tungsten and tantalum as well as nickel and cobalt based superalloys.
Please contact us with specific details of the material required, physical form, dimensions and quantity.
